Title:
FLEXIBLE WIRING BOARD, DRY FILM FOR COVERLAY, AND PRODUCTION METHOD FOR FLEXIBLE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2012/007992
Kind Code:
A1
Abstract:
Provided is a flexible wiring board having good flame retardant properties without the use of halogenated flame retardants, excellent resistance to bending, and minimal spring-back force. The flexible wiring board (1) is provided with: a substrate (2a) comprising a polyimide film; a circuit (2b) disposed on one main surface of the substrate (2a); and a coverlay (3) that covers the surface of the circuit (2b). The coverlay (3) is formed by a dry film for coverlays, and has a thickness of 10 to 50μm.
Inventors:
MAEZAWA HIDEKI (JP)
FUKUKAWA HIROSHI (JP)
FUKUKAWA HIROSHI (JP)
Application Number:
PCT/JP2010/004569
Publication Date:
January 19, 2012
Filing Date:
July 14, 2010
Export Citation:
Assignee:
KYOCERA CHEM CORP (JP)
MAEZAWA HIDEKI (JP)
FUKUKAWA HIROSHI (JP)
MAEZAWA HIDEKI (JP)
FUKUKAWA HIROSHI (JP)
International Classes:
H05K3/28
Domestic Patent References:
| WO2007063580A1 | 2007-06-07 | |||
| WO2008136096A1 | 2008-11-13 |
Foreign References:
| JP2009251480A | 2009-10-29 | |||
| JP2009275121A | 2009-11-26 | |||
| JP2005236273A | 2005-09-02 | |||
| JP2002012792A | 2002-01-15 | |||
| JP2008285632A | 2008-11-27 | |||
| JPH0447614A | 1992-02-17 | |||
| JP2003334907A | 2003-11-25 | |||
| JP2008266531A | 2008-11-06 | |||
| JP2007002170A | 2007-01-11 | |||
| JP2004331787A | 2004-11-25 | |||
| JP2004331783A | 2004-11-25 | |||
| JP2004075748A | 2004-03-11 | |||
| JP2004059777A | 2004-02-26 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
Patent business corporation cherry tree international patent firm (JP)
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Claims: