Title:
FLOW RATE SENSOR
Document Type and Number:
WIPO Patent Application WO/2017/057668
Kind Code:
A1
Abstract:
To provide a flow rate sensor able to minimize any deterioration in responsiveness and sensitivity relating to the flow of a fluid, even if a chip resistance unit positioned on an insulation substrate surface is used as a heat generating resistor and a temperature compensating resistor. The flow rate sensor (1) has a signal processing unit (4) for processing signals from a heat generating resistor (2) and a temperature compensating resistor (3). The heat generating resistor (2) is a chip resistance unit positioned on the front surface (5a) of an insulation substrate (5) made of plastic, and the temperature compensating resistor (3) is a chip resistance unit positioned on the rear surface (5b) of the insulation substrate (5). The temperature compensating resistor (3) is positioned on a heat-release path for the heat generating resistor (2), the heat-release path passing through the insulation substrate (5). The insulation substrate (5) reduces the possibility of contact between an airstream and the temperature compensating resistor (3) more than the possibility of contact between a fluid and the heat generating resistor (2).
Inventors:
IKENO TOMOKAZU (JP)
Application Number:
PCT/JP2016/079001
Publication Date:
April 06, 2017
Filing Date:
September 30, 2016
Export Citation:
Assignee:
KOA CORP (JP)
International Classes:
G01F1/698; G01F1/684; G01P5/12
Foreign References:
| JPH09243428A | 1997-09-19 | |||
| JPH0611374A | 1994-01-21 | |||
| JPH06109510A | 1994-04-19 | |||
| JPH0953967A | 1997-02-25 | |||
| JP2000227353A | 2000-08-15 | |||
| JPH08320245A | 1996-12-03 |
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (JP)
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