Title:
FLUX AND METHOD FOR PRODUCING BONDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2024/043223
Kind Code:
A1
Abstract:
Provided is a flux which is suitable for use in mounting indium sheets, has high wetting properties even in relatively low-temperature bonding, and is more inhibited from forming voids. The flux comprises a rosin, one or more organic acids, and a solvent (S). The organic acids include a monocarboxylic acid (A1) having a melting point of 35-90°C, and the solvent (S) comprises a solvent (S1) having a boiling point of 100°C or lower.
Inventors:
KAWANAGO TOMOHISA (JP)
KAJIKAWA YASUHIRO (JP)
KAJIKAWA YASUHIRO (JP)
Application Number:
PCT/JP2023/030091
Publication Date:
February 29, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; H01L23/373
Domestic Patent References:
| WO2016135938A1 | 2016-09-01 |
Foreign References:
| JPS5877791A | 1983-05-11 | |||
| JP2013126671A | 2013-06-27 | |||
| CN110153594A | 2019-08-23 | |||
| CN102059479A | 2011-05-18 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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