Title:
FLUX, SOLDER COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/137200
Kind Code:
A1
Abstract:
Provided is a flux containing a hydrogenated dimer acid and at least one polybutadiene (meth)acrylate compound selected from a group comprising polybutadiene (meth)acrylate compounds represented by formula 1 and polybutadiene (meth)acrylate compounds represented by formula 2.
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Inventors:
ARAI KENJI (JP)
FURUSAWA MITSUYASU (JP)
AOKI JUNICHI (JP)
TAKADA MAYUMI (JP)
NAKATSUMA MUNEHIKO (JP)
FURUSAWA MITSUYASU (JP)
AOKI JUNICHI (JP)
TAKADA MAYUMI (JP)
NAKATSUMA MUNEHIKO (JP)
Application Number:
PCT/JP2013/056660
Publication Date:
September 19, 2013
Filing Date:
March 11, 2013
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/363; B23K1/00; B23K31/02; H05K3/34; B23K101/42
Foreign References:
| JPH11179589A | 1999-07-06 | |||
| JP2004152936A | 2004-05-27 | |||
| JP2004230426A | 2004-08-19 | |||
| JP2007222932A | 2007-09-06 | |||
| JP2001150184A | 2001-06-05 | |||
| JP2008062252A | 2008-03-21 | |||
| JPH0924488A | 1997-01-28 | |||
| JPH1177377A | 1999-03-23 | |||
| JP2000052088A | 2000-02-22 | |||
| JPH11179589A | 1999-07-06 |
Other References:
See also references of EP 2826589A4
Attorney, Agent or Firm:
FUJIMOTO, NOBORU (JP)
Noboru Fujimoto (JP)
Noboru Fujimoto (JP)
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