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Title:
FLUX FOR SOLDER PASTE AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/230694
Kind Code:
A1
Abstract:
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass%. The flux also contains 0-20 mass% of a block organic acid and 0-3 mass% of an activator.

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Inventors:
HAYASHIDA TORU (JP)
HORIKOSHI RINA (JP)
Application Number:
PCT/JP2019/021024
Publication Date:
December 05, 2019
Filing Date:
May 28, 2019
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
WO2017122750A12017-07-20
WO2017122341A12017-07-20
Foreign References:
JP2016167561A2016-09-15
JP2013169557A2013-09-02
JP2016093816A2016-05-26
Other References:
See also references of EP 3804902A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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