FOAM SOLDER AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2007/125991

A1

Electronic components having a semiconductor element bonded to a substrate with solder weaken in bonding strength when a clearance between the semiconductor element and the substrate is not suitable. Therefore, foam solder having high melting point metallic particles dispersed in solder has been used to manufacture electronic components. However, when the electronic components are manufactured with the conventional foam solder, there have been cases where the semiconductor element is tilted and the bonding strength is not sufficient. A foam solder of this invention has a fluctuation of size of the high melting point metallic particles of 20μm or less when the metallic particle diameter is 50μm. An alloy layer composed of the high melting point metallic particles and the main component of solder is formed on the circumference of the high meting point metal particle. Furthermore, there is no void at all in the solder. In the electronic component, a semiconductor element is bonded to a substrate with the foam solder, and the electronic component has excellent heat cycle characteristics.

HIRANO NAOHIKO (JP)
SAKAMOTO YOSHITSUGU (JP)
OKUMURA TOMOMI (JP)
TSURUTA KAICHI (JP)
UESHIMA MINORU (JP)
ISHII TAKASHI (JP)

PCT/JP2007/059052

November 08, 2007

April 26, 2007

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SENJU METAL INDUSTRY CO (JP)
DENSO CORP (JP)
HIRANO NAOHIKO (JP)
SAKAMOTO YOSHITSUGU (JP)
OKUMURA TOMOMI (JP)
TSURUTA KAICHI (JP)
UESHIMA MINORU (JP)
ISHII TAKASHI (JP)

B23K35/14; H01L21/52; B23K35/40

JP2005161338A	2005-06-23
JPH06232188A	1994-08-19
JPH0631486A	1994-02-08
JPH06285686A	1994-10-11
JPH06685A	1994-01-11
JPH03281088A	1991-12-11

HIROSE, Shoichi (4-2 Nihonbashi Honcho 4-chom, Chuo-ku Tokyo 23, JP)

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