Title:
PHOTOSENSITIVE RESIN LAMINATE
Document Type and Number:
WIPO Patent Application WO/2007/125992
Kind Code:
A1
Abstract:
This invention provides a photosensitive resin laminate that develops a high
level of resolution and a high level of adhesion, can realize a steady side wall
in a resist pattern, is free from concaves on the surface of the resist pattern,
and is very small in skirt part after development. The photosensitive resin laminate
has an additional advantage that there is no problem of the separation of a support
film. The photosensitive resin laminate comprises a support film, and an intermediate
layer having a thickness of not less than 0.1 μm and not more than 10 μm
and a photosensitive resin layer provided in that order on the support film. The
intermediate layer is characterized by comprising polyvinyl alcohol and a specific
compound.
Inventors:
IGARASHI TSUTOMU (JP)
Application Number:
PCT/JP2007/059053
Publication Date:
November 08, 2007
Filing Date:
April 26, 2007
Export Citation:
Assignee:
ASAHI KASEI EMD CORP (JP)
IGARASHI TSUTOMU (JP)
IGARASHI TSUTOMU (JP)
International Classes:
G03F7/11; G03F7/004; G03F7/027
Foreign References:
JPH04130325A | 1992-05-01 | |||
JPH02113254A | 1990-04-25 | |||
JP2004163532A | 2004-06-10 | |||
JPH11288095A | 1999-10-19 | |||
JPH04208940A | 1992-07-30 | |||
JPH02213849A | 1990-08-24 | |||
JPS59137948A | 1984-08-08 | |||
JPH06118632A | 1994-04-28 | |||
JPH07199457A | 1995-08-04 | |||
JP2005352064A | 2005-12-22 | |||
JPH08220766A | 1996-08-30 |
Attorney, Agent or Firm:
ASAMURA, Kiyoshi et al. (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, JP)
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