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Patent Searching and Data


Title:
FOLDING SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/276955
Kind Code:
A1
Abstract:
A folding sensor (1) comprises a piezoelectric film (11), and an adhesive (10) which is disposed on a main surface of the piezoelectric film (11), and which affixes the piezoelectric film (11) to a foldable substrate (103). At least a folding part of an edge surface of the piezoelectric film (11) that is folded together with the substrate (103) is covered by the adhesive (10).

Inventors:
NISHIMOTO KEISUKE (JP)
Application Number:
PCT/JP2022/025581
Publication Date:
January 05, 2023
Filing Date:
June 27, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L1/16; G01B7/30
Domestic Patent References:
WO2019021856A12019-01-31
Foreign References:
JP2021043171A2021-03-18
JPH06174407A1994-06-24
JP2015015018A2015-01-22
US20120055257A12012-03-08
CN113838373A2021-12-24
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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