Title:
FORMATION OF FINE PITCH TRACES USING ULTRA-THIN PAA MODIFIED FULLY ADDITIVE PROCESS
Document Type and Number:
WIPO Patent Application WO/2021/031507
Kind Code:
A1
Abstract:
A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni-P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni-P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni-P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.
Inventors:
KELVIN PO LEUNG PUN (CN)
CHEE WAH CHEUNG (CN)
CHEE WAH CHEUNG (CN)
Application Number:
PCT/CN2020/000184
Publication Date:
February 25, 2021
Filing Date:
August 19, 2020
Export Citation:
Assignee:
COMPASS TECH COMPANY LIMITED (CN)
International Classes:
H01L23/498; B23K26/382; C23C18/50; C25D3/38; C25D5/02; H01L21/48; H01L23/14
Domestic Patent References:
| WO2019148308A1 | 2019-08-08 |
Foreign References:
| US20190385936A1 | 2019-12-19 | |||
| US20190043821A1 | 2019-02-07 | |||
| US20030143411A1 | 2003-07-31 | |||
| CN109791921A | 2019-05-21 | |||
| CN102450110A | 2012-05-09 | |||
| CN104105819A | 2014-10-15 |
Attorney, Agent or Firm:
KELONG INTERNATIONAL INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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