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Patent Searching and Data


Title:
FORMED BODY AND METHOD FOR PRODUCING FORMED BODY
Document Type and Number:
WIPO Patent Application WO/2023/139864
Kind Code:
A1
Abstract:
Provided is a formed body including an antenna printed with conductive ink, an IC chip fixed to the antenna by a first UV-curing resin that is cured by UV light, and an IC chip protective base material which is formed from a second UV-curing resin that is cured by UV light and covers at least the IC chip, the formed body being formed from a thermoplastic resin.

Inventors:
NITTA HARUHIKO (JP)
Application Number:
PCT/JP2022/039195
Publication Date:
July 27, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
SATO HOLDINGS KK (JP)
International Classes:
G06K19/02; B65D25/20; B65D51/24; G06K19/04; G06K19/077
Foreign References:
JP2003026225A2003-01-29
JP2005227890A2005-08-25
JP2000077617A2000-03-14
JP2021096540A2021-06-24
JP2018200632A2018-12-20
JP2020181478A2020-11-05
JP2015046729A2015-03-12
JP2018136746A2018-08-30
JP2005321935A2005-11-17
JP2021106264A2021-07-26
JPS6274694A1987-04-06
JP2020033041A2020-03-05
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
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