Title:
RESIN MATERIAL, METHOD FOR MANUFACTURING ADDITIVELY MANUFACTURED ARTICLE, AND METHOD FOR UPCYCLING RECYCLED RESIN
Document Type and Number:
WIPO Patent Application WO/2023/139865
Kind Code:
A1
Abstract:
Provided is a resin material that can suppress warping during additive manufacturing. In order to solve this problem, a resin material (2) is used in combination with a base resin (1) in additive manufacturing by laser irradiation, and contains an adjustment resin (22) comprising: a first polymerization unit that is the same as a polymerization unit present in the base resin (1); and a second polymerization unit that is disposed between adjacent first polymerization units and adjusts the bonding direction of the adjacent first polymerization units. In the polymerization segment in the adjustment resin (22) of the two first polymerization units and the second polymerization unit, the angle formed by two straight lines drawn from the center of gravity of the second polymerization unit to the respective centers of gravity of the adjacent first polymerization units is 100-140°. The energy of adsorption of the adjustment resin (22) versus the base resin (1) is 20-90 kJ/mol.
Inventors:
IWASAKI TOMIO (JP)
YAMAGUCHI AKIHIRO (JP)
YAMAGUCHI AKIHIRO (JP)
Application Number:
PCT/JP2022/039294
Publication Date:
July 27, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B33Y10/00; B29C64/153; B33Y70/00
Domestic Patent References:
| WO2016121013A1 | 2016-08-04 | |||
| WO2021049481A1 | 2021-03-18 | |||
| WO2022004405A1 | 2022-01-06 | |||
| WO2018043231A1 | 2018-03-08 | |||
| WO2022138954A1 | 2022-06-30 |
Foreign References:
| JP2012513319A | 2012-06-14 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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