FULL-COLOR LED DISPLAY MODULE AND PACKAGING METHOD THEREFOR AND DISPLAY SCREEN

WIPO Patent Application WO/2019/165778

A1

Disclosed is a packaging method for a full-color LED display module. The method comprises: step one: coating a package adhesive on a separation film; step two: placing a separation plate on a first jig, and then placing the separation film coated with the package adhesive on the separation plate, with the side of the separation film coated with the package adhesive upwards; step three: placing a solid-crystal full-color LED display module substrate on the package adhesive, with a chip of the full-color LED display module substrate downwards, and then placing a second jig; step four: combining the first jig and the second jig, and putting same into a vacuum press for vacuum lamination; and step five: after the lamination is completed, taking out the full-color LED display module substrate, and tearing off the separation film to finish the packaging operation. Correspondingly, the present invention further provides a full-color LED display module and a display screen. With the present invention, diversified selections of packaging sizes and packaging materials can be realized. The packaging quality is good, foaming is avoided, and the requirement on packaging equipment is low.

LI HONGHAO (CN)
YUAN YIKAI (CN)
LAI SHUFA (CN)
YANG LU (CN)
LIANG LIFANG (CN)
LI CHENG (CN)

PCT/CN2018/105937

September 06, 2019

September 17, 2018

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FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD (CN)

H01L51/56

CN108448012A	2018-08-24
CN102011952A	2011-04-13
CN104678465A	2015-06-03
CN106978133A	2017-07-25
CN206672555U	2017-11-24
JP2015160890A	2015-09-07

SCIHEAD PATENT AGENT CO., LTD (CN)

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