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Title:
FUSE ELEMENT AND FUSE DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/143353
Kind Code:
A1
Abstract:
[Problem] To provide a fuse element and fuse device with which, even if a low melting-point metal is melted at the temperature at the time of reflow mounting, the development of problems can be suppressed, such as the displacement of the blowout location away from a position according to design, or an increase in the conductor resistance in the portion devoid of the low melting-point metal. [Solution] A fuse element constituting a current flow path of a fuse device blows out by self-heat generation when a current exceeding ratings flows, the fuse element having a low melting-point metal layer and a high melting-point metal layer stacked on the low melting-point metal layer, the fuse element utilizing the action of the low melting-point metal layer eroding and blowing out the high melting-point metal layer and characterized in that the low melting-point metal layer and/or the high melting-point metal layer include a large film thickness portion and a small film thickness portion having different thicknesses. A fuse device uses the fuse element.

Inventors:
HASHITANI YUSUKE (JP)
Application Number:
PCT/JP2016/001356
Publication Date:
September 15, 2016
Filing Date:
March 10, 2016
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01H85/08
Domestic Patent References:
WO2015025883A12015-02-26
WO2015030023A12015-03-05
Foreign References:
JPS56134438A1981-10-21
JP2009099372A2009-05-07
JPS57109558U1982-07-06
Attorney, Agent or Firm:
SATO, MASARU (JP)
Masaru Sato (JP)
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