Title:
FUSE ELEMENT AND FUSE DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/143353
Kind Code:
A1
Abstract:
[Problem] To provide a fuse element and fuse device with which, even if a low melting-point metal is melted at the temperature at the time of reflow mounting, the development of problems can be suppressed, such as the displacement of the blowout location away from a position according to design, or an increase in the conductor resistance in the portion devoid of the low melting-point metal.
[Solution] A fuse element constituting a current flow path of a fuse device blows out by self-heat generation when a current exceeding ratings flows, the fuse element having a low melting-point metal layer and a high melting-point metal layer stacked on the low melting-point metal layer, the fuse element utilizing the action of the low melting-point metal layer eroding and blowing out the high melting-point metal layer and characterized in that the low melting-point metal layer and/or the high melting-point metal layer include a large film thickness portion and a small film thickness portion having different thicknesses. A fuse device uses the fuse element.
Inventors:
HASHITANI YUSUKE (JP)
Application Number:
PCT/JP2016/001356
Publication Date:
September 15, 2016
Filing Date:
March 10, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01H85/08
Domestic Patent References:
WO2015025883A1 | 2015-02-26 | |||
WO2015030023A1 | 2015-03-05 |
Foreign References:
JPS56134438A | 1981-10-21 | |||
JP2009099372A | 2009-05-07 | |||
JPS57109558U | 1982-07-06 |
Attorney, Agent or Firm:
SATO, MASARU (JP)
Masaru Sato (JP)
Masaru Sato (JP)
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