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Patent Searching and Data


Title:
FUSE ELEMENT AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/059955
Kind Code:
A1
Abstract:
Provided is a fuse element which can be surface-mounted by a reflow process and is capable of interrupting an electric current more reliably. A fuse element (1) which is provided with: a substrate (2); a conductive wiring line (13) which is arranged on the substrate (2); and low-melting-point metal layers (20, 21) which are arranged so as to directly or indirectly cover a part of the conductive wiring line (13) and have a lower melting point than the conductive wiring line (13), and which become a melt so as to form a fused part by melting the conductive wiring line (13). The low-melting-point metal layers (20, 21) are formed of pure Bi or a Bi-based alloy that contains 80% by weight or more of Bi.

Inventors:
IKEDA YUTAKA (JP)
TORII KIYOFUMI (JP)
SENTOKU SATORU (JP)
FUJISAWA ETSUKO (JP)
MIHARA KENJIRO (JP)
Application Number:
PCT/JP2014/065888
Publication Date:
April 30, 2015
Filing Date:
June 16, 2014
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01H85/11; H01H37/76; H01H69/02; H01H85/046
Domestic Patent References:
WO2000019472A12000-04-06
WO2014034287A12014-03-06
Foreign References:
JP2001057139A2001-02-27
JPS4954843A1974-05-28
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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