Title:
FUSION BONDING WAFER, TUBE FUSION BONDING DEVICE, AND TUBE FUSION BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/069835
Kind Code:
A1
Abstract:
In a fusion bonding wafer (18), a tube fusion bonding device (10), and a tube fusion bonding method, the fusion bonding wafer (18) is equipped with first and second substrates formed in a flat plate shape, a heating element formed between the inner surfaces of the first and second substrates, and a temperature measurement hole (44) that penetrates through the second substrate in a thickness direction thereof and exposes the inner surface of the first substrate. The temperature measurement hole allow temperature in the interior of the fusion bonding wafer (18) to be detected. Ideally, a non-contact sensor, e.g. infrared radiation thermometer (70), detects the temperature of the wafer (18). Advantageously, the wafer is used to cut and weld resin tubes such as those for medical use.
Inventors:
PAEPS FILIP (BE)
ROELANDT MAARTEN (BE)
BORTELS JOACHIM (BE)
VANDEKERCKHOVE LUCAS (BE)
ROELANDT MAARTEN (BE)
BORTELS JOACHIM (BE)
VANDEKERCKHOVE LUCAS (BE)
Application Number:
PCT/JP2022/036370
Publication Date:
April 04, 2024
Filing Date:
September 29, 2022
Export Citation:
Assignee:
TERUMO CORP (JP)
TERUMO BCT INC (US)
TERUMO BCT INC (US)
International Classes:
B29C65/20; A61M39/14; B29C65/22; B29C65/30; B29C65/78; H05B3/26; B29L23/00; H05B3/00
Foreign References:
| EP0139350A1 | 1985-05-02 | |||
| US4864101A | 1989-09-05 | |||
| EP3907060A1 | 2021-11-10 | |||
| JP3220229B2 | 2001-10-22 |
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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