Title:
GLASS CORE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING GLASS CORE
Document Type and Number:
WIPO Patent Application WO/2019/107251
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a glass core, a multilayer wiring substrate, and a method for manufacturing a glass core that allows copper wiring to be adequately performed and cracking or the like to be reduced. The glass core 1 comprises: a glass sheet 10; a first metal layer 20 provided on the glass sheet 10; a first electrolytic copper plating layer 30 provided on the first metal layer 20; a dielectric layer 40 provided above the first electrolytic copper plating layer 30; a second metal layer 50 provided on the dielectric layer 40; an electroless nickel plating layer 60 provided on the second metal layer 50, the electroless nickel plating layer 60 having a phosphorus content of less than 5 wt%; and a second electrolytic copper plating layer 70 provided on the electroless nickel plating layer 60.
Inventors:
TSUCHIDA TETSUYUKI (JP)
Application Number:
PCT/JP2018/043056
Publication Date:
June 06, 2019
Filing Date:
November 21, 2018
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H05K1/16; H01L23/12; H01L23/15; H05K1/09; H05K3/46
Domestic Patent References:
| WO2005027606A1 | 2005-03-24 |
Foreign References:
| JP2008227177A | 2008-09-25 | |||
| JPH1056247A | 1998-02-24 | |||
| JP2011155043A | 2011-08-11 | |||
| JPH10154878A | 1998-06-09 | |||
| JP2005026670A | 2005-01-27 |
Other References:
TAKAGI, KIYOSHI: "Yokuwakaru purinto haisenban no dekirumade (Easy to Understand Manufacturing Processes for Printed Circuit Boards", April 2008, NIKKAN KOGYO SHIMBUN, LTD., pages: 201 - 202
See also references of EP 3720258A4
See also references of EP 3720258A4
Attorney, Agent or Firm:
PATENT CORPORATE BODY DAI-ICHI KOKUSAI TOKKYO JIMUSHO (JP)
Download PDF: