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Title:
GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/207794
Kind Code:
A1
Abstract:
A glass substrate 10 according to the present invention is a glass substrate for manufacturing a semiconductor package, the glass substrate having: a pair of first and second main surfaces 11, 12 which face each other; and an end surface 13 connecting the pair of first and second main surfaces 11, 12, wherein the glass substrate 10 contains Si, Al, and Na, and the atomic concentration of Na in a depth of 20-100 nm from the outer surface of the end surface 13 is 18 at.% or less.

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Inventors:
YAMAMOTO HIROFUMI (JP)
ONO KAZUTAKA (JP)
Application Number:
PCT/JP2018/017835
Publication Date:
November 15, 2018
Filing Date:
May 08, 2018
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
C03C15/00; C03C3/083; H01L21/56; H01L23/12
Domestic Patent References:
WO2016143583A12016-09-15
WO2016088868A12016-06-09
WO2011068225A12011-06-09
Foreign References:
JP2016169141A2016-09-23
JP2013001593A2013-01-07
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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