Title:
GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLY AND COPPER/GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/090759
Kind Code:
A1
Abstract:
Disclosed is a graphene-containing carbonaceous member/ceramic assembly having a structure wherein a graphene-containing carbonaceous member (21) containing a graphene aggregate and a ceramic member (25) made of a ceramic containing nitrogen are joined together. At a joining interface (40) between the graphene-containing carbonaceous member (21) and the ceramic member (25), an active metal nitride layer (41) is formed on the joining surface of the ceramic member (25), and the thickness of the active metal nitride layer is within a range from 0.05 µm to 2 µm.
More Like This:
| JPH1167964 | MANUFACTURE OF SEMICONDUCTOR PACKAGE |
| JP5251900 | Manufacturing method of wiring board |
| JP2007027654 | SEMICONDUCTOR DEVICE |
Inventors:
OHASHI TOYO (JP)
SAKURAI AKIRA (JP)
SAKURAI AKIRA (JP)
Application Number:
PCT/JP2020/040652
Publication Date:
May 14, 2021
Filing Date:
October 29, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; H01L23/36; H01L23/373
Domestic Patent References:
| WO2010087432A1 | 2010-08-05 |
Foreign References:
| JP2015532531A | 2015-11-09 | |||
| JP2019129154A | 2019-08-01 | |||
| JP2012246173A | 2012-12-13 | |||
| JP6130362B2 | 2017-05-17 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF: