Title:
GUIDE APPARATUS AND CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/232986
Kind Code:
A1
Abstract:
A guide apparatus and a cutting device, for use in achieving no impact on a glass chip at the moment of beginning cutting and the moment of ending cutting, and also ensuring that the chip is sufficiently cut. The guide apparatus comprises a guide pressure block (200); a guide side of the guide pressure block (200) comprises a recess (201) and an outer surface (202); when the glass chip is accommodated in the recess (201), the surface of the glass chip and the outer surface (202) are in the same plane; the outer surface (202) is used for guiding a cutting wheel for cutting the glass chip to begin cutting and end cutting.
Inventors:
LIN JIAN (CN)
GAO JUN ZHAO (CN)
QI WEI BIN (CN)
ZHU KAI (CN)
GAO JUN ZHAO (CN)
QI WEI BIN (CN)
ZHU KAI (CN)
Application Number:
PCT/CN2018/107406
Publication Date:
December 12, 2019
Filing Date:
September 25, 2018
Export Citation:
Assignee:
BEIJING APOLLO DING RONG SOLAR TECH CO LTD (CN)
International Classes:
C03B33/023; C03B33/03; H01L21/683
Foreign References:
| CN205473337U | 2016-08-17 | |||
| CN205473337U | 2016-08-17 | |||
| CN203225245U | 2013-10-02 | |||
| JP2002252187A | 2002-09-06 |
Attorney, Agent or Firm:
SUNLAND LAW FIRM (CN)
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