Title:
HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/161843
Kind Code:
A1
Abstract:
The present invention provides a halogen-free thermosetting resin composition, a prepreg containing same, a laminate, and a printed circuit board. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, the following components: (A) halogen-free epoxy resin: 30-60 parts by weight; (B) phenolic curing agent: 10-35 parts by weight; and (C) phosphorus-containing flame retardant. The prepreg and laminate that are prepared from the halogen-free thermosetting resin composition provided by the present invention have excellent dimensional stability and dielectric properties, high adhesive strength, high heat resistance, low water absorbability, and good processability, and can achieve a halogen-free flame retardancy which qualifies for the UL94 V-0 rating.
Inventors:
YOU JIANG (CN)
HUANG TIANHUI (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
HUANG TIANHUI (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
Application Number:
PCT/CN2016/099093
Publication Date:
September 28, 2017
Filing Date:
September 14, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/092; B32B27/38; C08K5/49; C08L79/04; H05K3/02; H05K3/38
Foreign References:
| CN101643570A | 2010-02-10 | |||
| US5112932A | 1992-05-12 | |||
| CN101925629A | 2010-12-22 | |||
| CN1333791A | 2002-01-30 |
Other References:
See also references of EP 3412722A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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