Title:
HEAD-UP DISPLAY
Document Type and Number:
WIPO Patent Application WO/2020/158603
Kind Code:
A1
Abstract:
The present invention provides a head-up display in which it is possible to improve the heat dissipation properties of a heat sink. The present invention comprises: a circuit board 33 on which are mounted an LED 31 and wiring 37 connected to the LED 31; and a heat sink 35 having a base 41 that has one surface 41a on which the circuit board 33 is disposed, and another surface 41b that is the reverse surface from the one surface, a plurality of first heat dissipation fins 44 projecting from the other surface 41b, and a plurality of second heat dissipation fins 45 that intersect with the first heat dissipation fins 44 projecting from the other surface 41b and that form intersection points 48, the heat sink 35 being formed from a high-heat-conductivity resin material. The intersection points 48 are formed in positions overlapping with the wiring 37, with the base 41 interposed therebetween.
Inventors:
KANEKO BUNKICHI
SATO YOHEI
SATO YOHEI
Application Number:
PCT/JP2020/002506
Publication Date:
August 06, 2020
Filing Date:
January 24, 2020
Export Citation:
Assignee:
NIPPON SEIKI COLTD (JP)
International Classes:
B60K35/00; F21S2/00; F21V29/503; F21V29/75; F21V29/76; F21V29/87; G02B27/01; H01L33/00; H01L33/62; H01L33/64; F21Y103/00; F21Y115/10; F21Y115/20
Foreign References:
| JP2018137089A | 2018-08-30 | |||
| JP2011204442A | 2011-10-13 | |||
| JP2013012607A | 2013-01-17 | |||
| JP2013045632A | 2013-03-04 | |||
| JP2015111540A | 2015-06-18 | |||
| JP2003142637A | 2003-05-16 |
Download PDF: