Title:
HEAT-AGING-RESISTANT POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/130931
Kind Code:
A1
Abstract:
The present invention provides a heat aging-resistant polyamide resin composition having heat aging resistance that can withstand a high-temperature environment of about 200°C; the polyamide resin composition contains 0.1-5 parts by mass of polyacrylonitrile microparticles having an average particle size of 200 μm or less per 100 parts by mass of polyamide resin. The polyacrylonitrile microparticles preferably comprise a polyacrylonitrile polymer containing 50 mass% or more of an acrylonitrile component, and preferably also contain a copper compound and glass fibers.
Inventors:
ITO TOMOHIRO (JP)
YOSHIMURA NOBUHIRO (JP)
YOSHIMURA NOBUHIRO (JP)
Application Number:
PCT/JP2017/002240
Publication Date:
August 03, 2017
Filing Date:
January 24, 2017
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L77/00; C08K3/10; C08K7/14; C08L33/20
Foreign References:
| JPS5358548A | 1978-05-26 | |||
| JP2014015594A | 2014-01-30 | |||
| JP2003292774A | 2003-10-15 | |||
| JP2011046781A | 2011-03-10 | |||
| JP2015520278A | 2015-07-16 | |||
| JP2006001970A | 2006-01-05 | |||
| JP2011080029A | 2011-04-21 | |||
| JP2004131716A | 2004-04-30 |
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