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Patent Searching and Data


Title:
HEAT-CONDUCTING SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/019982
Kind Code:
A1
Abstract:
A heat-conducting sheet, etc., is provided having excellent flexibility and excellent heat conductivity in the thickness direction. A heat-conducting sheet 100 comprising: a plurality of heat-conducting parts 10 each being provided continuing from one main surface to another main surface; and joining parts 20 that join the adjacent boundary surfaces of the plurality of heat-conducting parts 10 layered in the main surface direction, the heat-conducting sheet 100 forming a sheet shape as a whole, wherein the heat-conducting parts 10 include gap sections, and the joining parts 20 are constituted from a material that includes a flexible resin material, and partially form a gap layer, a portion of the resin material being caused to partially penetrate the gap sections of the heat-conducting parts 10. Due to this configuration, the flexibility and plasticity of the heat-conducting sheet 100 is increased due to the gap sections of the heat-conducting parts 10 and the gap layer of the joining parts 20, and the resin material is caused to penetrate a part of the gap sections of the heat-conducting parts 10, whereby a gap layer can be formed between the heat-conducting parts 10, and the strength joining the heat-conducting parts 10 together can be maintained.

Inventors:
TOYA EIICHI (JP)
MATSUI KOJI (JP)
TOYOKAWA YUYA (JP)
SHIBATA KAZUKI (JP)
KAGAWA KATSUHIKO (JP)
YAMAGUCHI TAKAYUKI (JP)
Application Number:
PCT/JP2020/025001
Publication Date:
February 04, 2021
Filing Date:
June 25, 2020
Export Citation:
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Assignee:
AWA PAPER & TECH COMPANY INC (JP)
SHOWA MARUTSUTSU COMPANY LTD (JP)
International Classes:
H01L23/36; C09K5/14; H05K7/20
Domestic Patent References:
WO2017179318A12017-10-19
WO2011158942A12011-12-22
WO2016063541A12016-04-28
Foreign References:
JP2009055021A2009-03-12
JP2014150161A2014-08-21
JP2013149715A2013-08-01
Attorney, Agent or Firm:
TOYOSU Yasushi et al. (JP)
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