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Patent Searching and Data


Title:
HEAT CONDUCTION FILM AND HEAT-DISSIPATING STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/249339
Kind Code:
A1
Abstract:
[Problem] To provide a means for being able to selectively improve thermal conductivity in a surface direction of a heat conduction sheet. [Solution] A heat conduction film is configured by disposing a scale-like carbon material formed by a plurality of graphene layers such that adjacent scale-like carbon materials contact each other, and such that the major axis of the scale-like carbon material is oriented in the surface direction of the film.

Inventors:
KANEKO TAKAKO (JP)
NAITO TETSURO (JP)
TSUKADA YOSHIKO (JP)
YAJIMA ATSUHIKO (JP)
SHIRATORI KAZUYUKI (JP)
Application Number:
PCT/JP2021/020009
Publication Date:
December 01, 2022
Filing Date:
May 26, 2021
Export Citation:
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Assignee:
NISSAN MOTOR (JP)
International Classes:
C08J3/20; B29C70/62; B29C70/88; B32B9/00; C08J5/18; C08K3/04; C08K7/00; C09K5/00; H01L23/36; H05K7/20
Domestic Patent References:
WO2013099089A12013-07-04
WO2018030430A12018-02-15
Foreign References:
JP2015036383A2015-02-23
JP2017141443A2017-08-17
JP2018095691A2018-06-21
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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