Title:
THERMALLY CONDUCTIVE FILM AND HEAT DISSIPATION STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/249338
Kind Code:
A1
Abstract:
[Problem] To provide a means for allowing a selective improvement of thermal conductivity in the surface direction of a thermally conductive sheet. [Solution] This thermally conductive film is formed by: arranging a binder and a scale-like carbon materials formed by a plurality of graphene layers such that the adjacent scale-like carbon materials contact each other and the major axis of the scale-like carbon materials is oriented in the surface direction of the film; and making at least some among the minor axis of the binder and the minor axes of spaces formed by the scale-like carbon materials and the binder smaller than the minor axis of the scale-like carbon materials.
Inventors:
NAITO TETSURO (JP)
TSUKADA YOSHIKO (JP)
KENEKO TAKAKO (JP)
YAJIMA ATSUHIKO (JP)
SHIRATORI KAZUYUKI (JP)
TSUKADA YOSHIKO (JP)
KENEKO TAKAKO (JP)
YAJIMA ATSUHIKO (JP)
SHIRATORI KAZUYUKI (JP)
Application Number:
PCT/JP2021/020008
Publication Date:
December 01, 2022
Filing Date:
May 26, 2021
Export Citation:
Assignee:
NISSAN MOTOR (JP)
International Classes:
C08J3/20; B29C70/62; B29C70/88; B32B9/00; C08J5/18; C08K3/04; C08K7/00; C09K5/00; H01L23/36; H05K7/20
Domestic Patent References:
| WO2013099089A1 | 2013-07-04 | |||
| WO2018030430A1 | 2018-02-15 |
Foreign References:
| JP2015036383A | 2015-02-23 | |||
| JP2017141443A | 2017-08-17 | |||
| JP2018095691A | 2018-06-21 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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