Title:
HEAT-CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/190270
Kind Code:
A1
Abstract:
[Problem] To provide a sheet which can be produced continuously by coating molding, can be wound in a roll-like shape, and has high heat conductivity and high insulation properties.
[Solution] A heat-conductive sheet which comprises a glass cloth sealed with a heat-conductive resin composition and a layer arranged on both surfaces or one surface of the glass cloth and comprising a cured product of a heat-conductive silicone composition, wherein the heat-conductive silicone composition comprises a silicone component and a heat-conductive filler (C), the amount of the heat-conductive filler (C) is 1200 to 2000 parts by mass relative to 100 parts by mass of the silicone component, the heat-conductive filler (C) has an average particle diameter of less than 15 μm, and the amount of particles each having a particle diameter of 45 μm or more is 0 to 3% by mass and the amount of particles each having a particle diameter of 75 μm or more is 0 to 0.01% by mass in the heat-conductive filler (C).
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Inventors:
ISHIHARA YASUHISA (JP)
ENDO AKIHIRO (JP)
MARUYAMA TAKAHIRO (JP)
ENDO AKIHIRO (JP)
MARUYAMA TAKAHIRO (JP)
Application Number:
PCT/JP2015/064859
Publication Date:
December 17, 2015
Filing Date:
May 25, 2015
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L23/36; C08K7/18; C08L83/04; H01L23/373; H05K7/20
Foreign References:
| JP2002003831A | 2002-01-09 | |||
| JPH01173514A | 1989-07-10 | |||
| JP2007059877A | 2007-03-08 | |||
| JP2013095023A | 2013-05-20 |
Other References:
See also references of EP 3157052A4
Attorney, Agent or Firm:
MATSUI Mitsuo et al. (JP)
Mitsuo Matsui (JP)
Mitsuo Matsui (JP)
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