Title:
HEAT-CURED CONDUCTIVE ADHESIVE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/188504
Kind Code:
A1
Abstract:
The present application relates to the field of conductive adhesives, and specifically relates to a heat-cured conductive adhesive and a preparation method therefor. The preparation method for the heat-cured conductive adhesive mainly comprises the following step: heat-curing raw materials at 150-200ºC for 30-60 min, wherein the raw materials comprise the following components in parts by weight: 5-14.5 parts of an epoxy resin, 3-10 parts of a diluent, 0.5-1 parts of a curing agent, 1.5-4.5 parts of a flexible auxiliary agent and 70-90 parts of a micron silver powder. The heat-cured conductive adhesive prepared by means of the preparation method has good rheological and mechanical properties, and also has the advantages of a low volume resistance, a high bonding strength, a high impact strength, a low glass transition temperature, a low storage modulus, etc.
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Inventors:
CUI HUIWANG (CN)
LU CHUNHUI (CN)
LU CHUNHUI (CN)
Application Number:
PCT/CN2021/139775
Publication Date:
September 15, 2022
Filing Date:
December 20, 2021
Export Citation:
Assignee:
DK ELECTRONIC MAT INC (CN)
International Classes:
C09J4/06; C09J4/02; C09J9/02; C09J11/06; C09J11/08; C09J163/10
Foreign References:
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| CN101864262A | 2010-10-20 | |||
| CN106349992A | 2017-01-25 | |||
| CN108130036A | 2018-06-08 | |||
| CN104962226A | 2015-10-07 | |||
| CN108047986A | 2018-05-18 | |||
| CN102676102A | 2012-09-19 | |||
| CN110093116A | 2019-08-06 | |||
| US20070213429A1 | 2007-09-13 | |||
| US20200157388A1 | 2020-05-21 | |||
| JPS63278987A | 1988-11-16 |
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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