Title:
HEAT DISSIPATION ADJUSTMENT STRUCTURE, BATTERY PACK, AND FLUID FLOW DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/152688
Kind Code:
A1
Abstract:
Provided is a heat dissipation adjustment structure that makes it possible to adjust the dissipation of heat from a heat source. A thermal switch 12 is formed from a first material in which the thermal resistance at room temperature is larger than 1.0 × 10-5 (m2∙K)/W and the thermal resistance at 100 °C is 2/3 or less of the thermal resistance at room temperature. The heat dissipation adjustment structure 11 is formed by providing the thermal switch 12 around a heat source that generates heat. The dissipation of heat from the heat source is adjusted as a result of the thermal conductivity of the switch 12 varying with temperature.
Inventors:
TOMITA TAKAHIRO (JP)
NAGAI KENKICHI (JP)
KOBAYASHI HIROHARU (JP)
NAGAI KENKICHI (JP)
KOBAYASHI HIROHARU (JP)
Application Number:
PCT/JP2016/058377
Publication Date:
September 29, 2016
Filing Date:
March 16, 2016
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01M10/653; H01M10/613; H01M10/615; H01M10/635; H01M10/651; H01M10/6551; H01M10/658; H01M50/204; F01M5/00
Domestic Patent References:
| WO2014148585A1 | 2014-09-25 | |||
| WO2014156991A1 | 2014-10-02 | |||
| WO2012153752A1 | 2012-11-15 |
Foreign References:
| JP2004327223A | 2004-11-18 | |||
| JP2014043835A | 2014-03-13 |
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
Ippei Watanabe (JP)
Ippei Watanabe (JP)
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