Title:
HEAT DISSIPATION DEVICE AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2022/190794
Kind Code:
A1
Abstract:
A vapor chamber 1A that is one embodiment of a heat dissipation device includes: a housing 10 having a first inner wall surface 11a and a second inner wall surface 12a that are opposed to each other in the thickness direction Z; a working medium 20 that is enclosed in an internal space of the housing 10; and a wick 30 that is disposed between the first inner wall surface 11a and the second inner wall surface 12a of the housing 10. The wick 30 is constituted of a fiber bundle in which fibers F are bundled in a linear fashion. Liquid flow path(s) 41 and/or 42 realized by a capillary force are/is formed along the direction in which the wick 30 extends, between the wick 30 and at least one of the first inner wall surface 11a and the second inner wall surface 12a.
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Inventors:
NUMOTO TATSUHIRO (JP)
Application Number:
PCT/JP2022/006142
Publication Date:
September 15, 2022
Filing Date:
February 16, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
F28D15/02; F28D15/04
Domestic Patent References:
| WO2010098303A1 | 2010-09-02 | |||
| WO2019131599A1 | 2019-07-04 |
Foreign References:
| JP2018076987A | 2018-05-17 | |||
| US20170343294A1 | 2017-11-30 | |||
| US3681843A | 1972-08-08 | |||
| JPS61161395A | 1986-07-22 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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