HEAT DISSIPATION DEVICE, HEAT DISSIPATION UNIT, AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2018/133460

A1

Provided are a heat dissipation device, a heat dissipation unit, and an electronic apparatus. The heat dissipation device comprises a base (110), a blade-shaped oscillating heat dissipation assembly (120), a driving assembly (130), and a magnetic assembly (140). The driving assembly is fixed to the base. One end of the blade-shaped oscillating heat dissipation assembly is fixed to the base and located in the same plane as the base. There is an included angle between the blade-shaped oscillating heat dissipation assembly and a vertical plane of the base. The magnetic assembly is provided at the blade-shaped oscillating heat dissipation assembly. The magnetic assembly is arranged in a position corresponding to the driving assembly. A force acting between the magnetic assembly and the driving assembly drives the blade-shaped oscillating heat dissipation assembly to oscillate. An oscillation area of the blade-shaped oscillating heat dissipation assembly constitutes a large fan-shaped area, such that an air volume generated by the blade-shaped oscillating heat dissipation assembly is significantly increased, thereby expanding a heat dissipation area.

JPH10321780	SEMICONDUCTOR DEVICE
JP2022107932	HEATSINK AND ELECTRONIC COMPONENT MODULE
JP2004088845	FORCED AIR-COOLING POWER CONVERTOR

LI LIANG (CN)
LI JIANGUANG (CN)
HU CHIH FENG (CN)

PCT/CN2017/106015

July 26, 2018

October 13, 2017

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HUAWEI TECH CO LTD (CN)

H01L23/467

CN106783771A	2017-05-31
CN205356927U	2016-06-29
CN101153617A	2008-04-02

SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)

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