Title:
HEAT DISSIPATION FIN, MANUFACTURING METHOD FOR HEAT DISSIPATION FIN, AND SEMICONDUCTOR PACKAGE PROVIDED WITH HEAT DISSIPATION FIN
Document Type and Number:
WIPO Patent Application WO/2017/061307
Kind Code:
A1
Abstract:
The present invention provides: a heat dissipation fin which is formed of a sheet-making molded article containing a thermosetting resin, a fibrous filler made from at least one of carbon fiber and metal fiber, and a powdery filler made from a carbon material; and a manufacturing method for a heat dissipation fin, comprising a step for manufacturing, by using a sheet-making method, a sheet-making article from material slurry containing a thermosetting resin, a fibrous filler made from at least one of carbon fiber and metal fiber, and a powdery filler made from a carbon material, and a step for molding the sheet-making article by performing heating and pressurization thereon, to manufacture a heat dissipation fin formed of the sheet-making molded article.
Inventors:
SUGINO RYOSUKE (JP)
TANIGUCHI TAKAOKI (JP)
TANIGUCHI TAKAOKI (JP)
Application Number:
PCT/JP2016/078470
Publication Date:
April 13, 2017
Filing Date:
September 27, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/373
Foreign References:
| JP2015056235A | 2015-03-23 | |||
| JP2012049407A | 2012-03-08 | |||
| JP2012079754A | 2012-04-19 | |||
| JP2010053224A | 2010-03-11 | |||
| JP2000101004A | 2000-04-07 | |||
| JP2012025831A | 2012-02-09 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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