Title:
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/257963
Kind Code:
A1
Abstract:
The present application provides a heat dissipation member and an electronic device comprising same. The heat dissipation member comprises a housing and a cooling medium located inside the housing, the housing is sealed to form a sealed cavity, and the cooling medium is located in the sealed cavity; the housing comprises a first layer and a second layer, the first layer and the second layer are stacked, the second layer is close to the cooling medium relative to the first layer, different materials are used for the first layer and the second layer, and the material used for the second layer comprises metal; a part of the housing is provided with an accommodating recess, the accommodating recess is recessed from the outer surface of the housing to the second layer, and the accommodating recess is used for accommodating a heating member. The heat dissipation member provided by the present application can be bent and deformed, and the equivalent thermal resistance of the housing in the heat dissipation member is small, thus facilitating improvement of the heat dissipation performance of the heat dissipation member.
Inventors:
JIN LINFANG (CN)
SUN YALONG (CN)
TANG YONG (CN)
LIU YONGLU (CN)
SUN YALONG (CN)
TANG YONG (CN)
LIU YONGLU (CN)
Application Number:
PCT/CN2022/097617
Publication Date:
December 15, 2022
Filing Date:
June 08, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; H05K9/00
Foreign References:
| CN113556919A | 2021-10-26 | |||
| CN112595155A | 2021-04-02 | |||
| TW200509337A | 2005-03-01 | |||
| CN112696957A | 2021-04-23 | |||
| CN210324970U | 2020-04-14 | |||
| JP3195723U | 2015-01-29 | |||
| US20180376626A1 | 2018-12-27 | |||
| CN202110649797A | 2021-06-10 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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