Title:
HEAT DISSIPATION MEMBER AND HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2021/149161
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a heat dissipation member (13) capable of improving the average emissivity in an infrared region, compared with the prior art. The heat dissipation member (13) includes a thermal-radiation ceramic material (20), and the thermal-radiation ceramic material (20) consists primarily of silicon nitride and boron nitride. The mass ratio of the boron nitride with respect to the mass of the silicon nitride and the boron nitride is 10-40 mass% inclusive.
Inventors:
MASAKI MOTOKI (JP)
TOKIZAKI SHINYA (JP)
TOKIZAKI SHINYA (JP)
Application Number:
PCT/JP2020/001987
Publication Date:
July 29, 2021
Filing Date:
January 21, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H05K7/20
Foreign References:
| JPH07336001A | 1995-12-22 | |||
| JP2002201076A | 2002-07-16 | |||
| JP2005026581A | 2005-01-27 | |||
| JP2016216318A | 2016-12-22 | |||
| JPH03141161A | 1991-06-17 | |||
| JP6616555B1 | 2019-12-04 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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