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Title:
HEAT DISSIPATION SHEET PROVIDED WITH FINE PROJECTION AND RECESS LAYER ON BASE MATERIAL SURFACE, AND HEAT DISSIPATION MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/084272
Kind Code:
A1
Abstract:
[Problem] Provided is a heat dissipation sheet that can effectively radiate the temperature of a heating element to outside. [Solution] Provided are: a thermal conductor that diffuses the heat of the heating element over the entire surface area; and a base material provided on the surface side of the thermal conductor, for which a fine projection and recess layer is formed on the surface, and a projecting part of the fine projection and recess layer has a height of less than 1 µm, and a density of 100 units/1 µm2 or greater. More preferably, the projecting part of the fine projection and recess layer has a height of 200 nm or less, and a density of 400 units/1 µm2 or greater. In the projecting part of the heat dissipation sheet, the size of the surface area on the side surface of the projecting part is 10 times or greater than the size of the bottom area of the projecting part. The fine projection and recess layer in the heat dissipation sheet is a coating film formed on the base material of the heat dissipation sheet, using any of: a solution of an alkali metal salt silicate compound, a solution of an ultrafine particle silicon dioxide compound, or a solution prepared by mixing alcohols, an organic compound, an inorganic compound, and water with those solutions.

Inventors:
IWATA SHUJI (JP)
Application Number:
PCT/JP2017/039836
Publication Date:
May 11, 2018
Filing Date:
November 02, 2017
Export Citation:
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Assignee:
GLOBALI CO LTD (JP)
International Classes:
H01L23/36; B32B7/02; H01L23/373; H05K7/20
Domestic Patent References:
WO2009142036A12009-11-26
Foreign References:
JP2011096989A2011-05-12
JPH09232482A1997-09-05
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY GLOBAL INTELLECTUAL PROPERTY (JP)
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