Title:
HEAT DISSIPATION STRUCTURE OF COOLING PLATE FOR POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2022/095750
Kind Code:
A1
Abstract:
A heat dissipation structure of a cooling plate for a power semiconductor module, the present heat dissipation structure comprising a power chip, a first solder layer, a copper-clad ceramic substrate, a second solder layer and a cooling plate body, which are sequentially arranged from top to bottom. The heat dissipation structure further comprises a straight rib mechanism and a pin rib mechanism, wherein the straight rib mechanism is arranged on a bottom surface of the cooling plate body, and the pin rib mechanism is arranged on the surface of a straight rib mechanism. The heat dissipation structure overcomes the defects of a traditional flat-plate cooling plate, effectively increases the convection heat exchange coefficient and heat dissipation area of the fluid-solid contact surface, increases the transferred heat caused by the macroscopic flow of the fluid and the delivered heat generated by the heat conduction of molecules in the fluid, enhances the heat dissipation performance of the power semiconductor module, improves the thermal reliability of the power semiconductor module, and prolongs the service life thereof.
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Inventors:
WANG CHANGCHENG (CN)
TANG YUSHENG (CN)
MAO XIANYE (CN)
GUO JIANWEN (CN)
TANG YUSHENG (CN)
MAO XIANYE (CN)
GUO JIANWEN (CN)
Application Number:
PCT/CN2021/126306
Publication Date:
May 12, 2022
Filing Date:
October 26, 2021
Export Citation:
Assignee:
ZHENGHAI GROUP CO LTD (CN)
International Classes:
H01L23/367; H01L23/473
Foreign References:
| CN112466825A | 2021-03-09 | |||
| CN207967049U | 2018-10-12 | |||
| CN110220402A | 2019-09-10 | |||
| CN104807362A | 2015-07-29 | |||
| CN103697749A | 2014-04-02 | |||
| CN1725479A | 2006-01-25 | |||
| CN105188307A | 2015-12-23 | |||
| EP1926143A1 | 2008-05-28 | |||
| CN202011230363A | 2020-11-06 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
Download PDF:
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