Title:
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO2005081605
Kind Code:
A3
Abstract:
The invention provides a heat dissipation structure for electronic devices that can improve heat dissipation efficiency, while making use of the natural features of a wooden material as a covering member. The invention is related to a heat dissipation structure for the electronic device 1, the covering members 2 and 3 of which are made of a compressed wooden material, and is characterized by exposing outside a portion of the metal heat dissipation frame 20 provided inside. Because of this, the heat generated inside of the electronic device 1 is dissipated outside through the heat dissipation frame 20 with high heat conductivity from the portion of the heat dissipation frame 20 exposed outside.
Inventors:
SUZUKI TATSUYA (JP)
Application Number:
PCT/JP2005/002667
Publication Date:
November 10, 2005
Filing Date:
February 15, 2005
Export Citation:
Assignee:
OLYMPUS CORP (JP)
SUZUKI TATSUYA (JP)
SUZUKI TATSUYA (JP)
International Classes:
H05K7/20; (IPC1-7): H05K7/20
Domestic Patent References:
| WO2003021921A1 | 2003-03-13 | |||
| WO2005055564A1 | 2005-06-16 |
Foreign References:
| EP0391020A1 | 1990-10-10 | |||
| JPH10304034A | 1998-11-13 | |||
| EP1473193A1 | 2004-11-03 |
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