Title:
HEAT-INSULATION FILM FOR HIGH TEMPERATURE MOLDING, VACUUM THERMAL INSULATOR USING SAME AND PROCESS FOR FABRICATING VACUUM THERMAL INSULATOR
Document Type and Number:
WIPO Patent Application WO/2014/061901
Kind Code:
A1
Abstract:
The present invention proposes a heat-insulation film laid so as to be molded at a high temperature, a vacuum thermal insulator having a core material with the outside coated with the heat-insulation film, and a method for fabricating the vacuum thermal insulator by coating the outside of the core material with the insulation film through a thermal-adhesion process. The heat-insulation film according to the present invention may be stably coated on the outside of the core material through the thermal-adhesion process at a high temperature.
Inventors:
KIM JUNG WON (KR)
Application Number:
PCT/KR2013/006242
Publication Date:
April 24, 2014
Filing Date:
July 12, 2013
Export Citation:
Assignee:
DO YOUNG H S CO LTD (KR)
International Classes:
B32B27/08; B32B7/12; B32B17/10; F16L59/065
Foreign References:
| JP2005163989A | 2005-06-23 | |||
| KR20120016743A | 2012-02-27 | |||
| KR20060113436A | 2006-11-02 | |||
| JP2006038082A | 2006-02-09 | |||
| JP2005036975A | 2005-02-10 |
Attorney, Agent or Firm:
NEIT INTERNATIONAL PATENT AND LAW FIRM (KR)
특허법인네이트 (KR)
특허법인네이트 (KR)
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