HEAT INSULATION STRUCTURE

WIPO Patent Application WO/2018/056439

A1

The objective of the present invention is to provide a heat insulation structure which is able to exhibit a superior heat insulation effect even for a body to be cooled that generates a large amount of heat, and which is able to exhibit a superior cooling effect due to having a superior heat transfer characteristic. This heat insulation structure has a container that is equipped with a first plate-shaped body, a second plate-shaped body opposing the first plate-shaped body, and a partition plate partitioning the first plate-shaped body and the second plate-shaped body, and in which a first hollow space is formed by the first plate-shaped body and the partition plate, and a second hollow space is formed by the second plate-shaped body and the partition plate. A wick structure and a working fluid are sealed inside the second hollow space.

JP2019027444	EXTERNAL PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL
WO/2014/183622	VACUUM THERMAL-INSULATION LAYER HAVING PLURALITY OF UNIT CAVITIES, AND METHOD FOR PRODUCING SAME
WO/2017/047748	GAS BARRIER FILM AND THERMAL INSULATION PANEL

INAGAKI YOSHIKATSU (JP)
AOKI HIROFUMI (JP)

PCT/JP2017/034537

March 29, 2018

September 25, 2017

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FURUKAWA ELECTRIC CO LTD (JP)

F16L59/065; F25D23/06

JP2009229764A	2009-10-08
JP2008153423A	2008-07-03
JP2010190257A	2010-09-02
JP2013170652A	2013-09-02
JP2011122610A	2011-06-23
JP2006275188A	2006-10-12

EINSEL Felix-Reinhard et al. (JP)

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