Title:
HEAT MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/162548
Kind Code:
A1
Abstract:
[Problem] To provide a heat management system which, when a heat medium is being circulated to a temperature regulation target in order to regulate the temperature thereof, is capable of regulating the temperature of the temperature regulation target at low cost, and is also capable of resolving problems associated with non-uniformity of the heat medium. [Solution] A storage unit 26 is provided on a pathway for returning a heat medium from a temperature regulating circuit 42 to a low-temperature heat medium circuit 43, 43A. The storage unit 26 comprises: a high-temperature side storage chamber 65 into which the heat medium flowing through a high-temperature heat medium circuit 44 is introduced, and which has high-temperature side outlets 64A, 66A for returning the heat medium to the high-temperature heat medium circuit 44; a temperature regulation side storage chamber 63 into which the heat medium circulating through the temperature regulating circuit 42 is introduced, and which stores the heat medium; and a partition wall 67 for partitioning the high-temperature side storage chamber 65 and the temperature regulation side storage chamber 63, with the heat medium inside the high-temperature side storage chamber 65 and the heat medium inside the temperature regulation side storage chamber 63 in a heat-exchange relationship.
Inventors:
UCHIKADO IWAO (JP)
Application Number:
PCT/JP2023/002095
Publication Date:
August 31, 2023
Filing Date:
January 24, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
B60K11/02; B60H1/08; B60H1/22; H01M10/613; H01M10/615; H01M10/625; H01M10/633; H01M10/6556; H01M10/6568; H01M10/663
Domestic Patent References:
| WO2022004159A1 | 2022-01-06 |
Foreign References:
| JP2021154912A | 2021-10-07 |
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