Title:
HEAT MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/162549
Kind Code:
A1
Abstract:
[Problem] To provide a heat management system that is capable of controlling temperature efficiently at low cost for a to-be-temperature-controlled subject when controlling temperature by circulating a heating medium through the to-be-temperature-controlled subject and that is also capable of solving problems associated with deviation of the heating medium. [Solution] The present invention comprises: a temperature control circuit 42 that includes a third pump 23 for circulating a heating medium through a battery 2; a high-temperature heating medium circuit 44 that causes a heating medium heated by a heating unit 14 for heating the same to circulate; a low-temperature heating medium circuit 43A that causes a heating medium cooled by a cooling unit 13 for cooling the same to circulate; thermo valves 31 and 30 that selectively introduce the heating medium flowing through the high-temperature heating medium circuit 44 and the heating medium flowing through the low-temperature heating medium circuit 43A into the temperature control circuit 42; and a storage unit 26 that is provided on a path through which the heating medium is returned from the temperature control circuit 42 to the high-temperature heating medium circuit 44 or the low-temperature heating medium circuit 43A, and that stores the heating medium.
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Inventors:
UCHIKADO IWAO (JP)
Application Number:
PCT/JP2023/002096
Publication Date:
August 31, 2023
Filing Date:
January 24, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
B60K11/02; B60H1/22; H01M10/613; H01M10/615; H01M10/625; H01M10/633; H01M10/6556; H01M10/6568; H01M10/663
Domestic Patent References:
| WO2017038593A1 | 2017-03-09 |
Foreign References:
| JP2020178469A | 2020-10-29 | |||
| JP2016003828A | 2016-01-12 |
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