Title:
HEAT MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/162550
Kind Code:
A1
Abstract:
[Problem] To provide a heat management system that, when a heat medium is circulated to control the temperature of an object that needs temperature control, enables accurate temperature control, including warming up, and also eliminates problems associated with heat medium unevenness. [Solution] A heat management system comprises: a first circulation route 42 having a third pump 23 for circulating a heat medium to a battery 2; a second circulation route 43 having a cooling section 13 for cooling the heat medium; a third circulation route 44 having a heating section 14 for heating the heat medium; a heat exchange section 63 for exchanging heat between the heat medium circulating in the third circulation route 44 and the heat medium circulating in the battery 2; and a thermovalve 30. The thermovalve 30 controls the heat exchange between the heat medium flowing in the first circulation route 42 and the heat medium flowing in the third circulation route 44 in the heat exchange section 63.
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Inventors:
UCHIKADO IWAO (JP)
Application Number:
PCT/JP2023/002097
Publication Date:
August 31, 2023
Filing Date:
January 24, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
B60K11/02; B60H1/22; H01M10/613; H01M10/615; H01M10/625; H01M10/633; H01M10/6556; H01M10/6566; H01M10/663
Domestic Patent References:
| WO2017038593A1 | 2017-03-09 | |||
| WO2022004159A1 | 2022-01-06 |
Foreign References:
| JP2020178469A | 2020-10-29 | |||
| JP2016003828A | 2016-01-12 | |||
| JP2021154912A | 2021-10-07 |
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