Title:
HEAT MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/203941
Kind Code:
A1
Abstract:
[Problem] To provide a heat management system that can predict the occurrence of failure of a system and delay the occurrence of that failure. [Solution] A heat management system comprising a heat medium circuit that circulates a heat medium that underwent heat exchange with a refrigerant circuit to a temperature control object, and a control device 9 that performs temperature control of the temperature control object by controlling this heat medium circuit, where the control device 9 comprises a failure prediction unit 63 that predicts the occurrence of failure of the system on the basis of information related to the life of the devices configuring the system, and a life extension control unit 64 that executes a prescribed life extension control for delaying the occurrence of that failure on the basis of the prediction of failure of the system by this failure prediction unit 63.
Inventors:
IWAZAKI WATARU (JP)
TAKAZAWA OSAMU (JP)
SATO MASAAKI (JP)
SHIMIZU NOBUTAKA (JP)
TAKAZAWA OSAMU (JP)
SATO MASAAKI (JP)
SHIMIZU NOBUTAKA (JP)
Application Number:
PCT/JP2023/011040
Publication Date:
October 26, 2023
Filing Date:
March 21, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
B60H1/22; H01M10/633; B60K1/04; H01M10/42; H01M10/48; H01M10/613; H01M10/615; H01M10/625; H01M10/6556
Domestic Patent References:
| WO2011016264A1 | 2011-02-10 |
Foreign References:
| JP2019168179A | 2019-10-03 | |||
| JP2019214957A | 2019-12-19 | |||
| JPH01118052A | 1989-05-10 |
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