Title:
HEAT MEDIUM CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2023/203942
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing an increase in accommodating space for an overall heat medium circuit when providing a reservoir tank as a storage unit in the heat medium circuit to manage an amount of a heat medium resulting from expansion of the heat medium and flow passage switching. The present invention provides a heat medium circuit comprising a high-temperature heat medium flow passage (20) including a heating unit (21) and a first pump (P1) for pumping a heat medium to the heating unit, a low-temperature heat medium flow passage (30) including a cooling unit (31) and a second pump (P2) for pumping the heat medium to the cooling unit, a temperature regulation target heat medium flow passage (40) for feeding the heat medium to a temperature regulation target, a storage unit (50) for storing the heat medium, and flow passage switching units (V1, V2, 60) for switching between whether the high-temperature heat medium flow passage, the low-temperature heat medium flow passage, and the temperature regulation target heat medium flow passage are each independent flow passages or are connected flow passages, characterized in that the storage unit is provided with inflow ports (52, 54) connected to the high-temperature heat medium flow passage and the temperature regulation target heat medium flow passage, and is provided with an outflow port (53) connected to the low-temperature heat medium flow passage.
Inventors:
SHIMIZU NOBUTAKA (JP)
Application Number:
PCT/JP2023/011041
Publication Date:
October 26, 2023
Filing Date:
March 21, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
B60H1/22
Foreign References:
| JP2011112312A | 2011-06-09 | |||
| JP2017019449A | 2017-01-26 | |||
| JP2020045068A | 2020-03-26 | |||
| JP2014061873A | 2014-04-10 | |||
| JPH10266856A | 1998-10-06 |
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