Title:
HEAT PROCESSING DEVICE, HEAT PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2023/219030
Kind Code:
A1
Abstract:
This heat processing device heats a substrate on which a coating film is formed, the device comprising: a processing vessel for forming a processing space that accommodates the substrate; a hot plate having a placement surface on which the substrate accommodated in the processing space is placed, and a heating unit that heats the substrate; an adjustment mechanism that adjusts the height of the substrate with respect to the hot plate; an exhaust part that exhausts the processing space; and a control unit. the control unit performs control so as to execute: (A) a step for setting the height of the substrate with respect to the hot plate to a prescribed height separated by a prescribed distance from the hot plate, and starting a heating process for the substrate; and (B) a step for lowering the height of the substrate with respect to the hot plate below the prescribed height when the heating process has reached a prescribed degree of progression, setting the substrate to a state of being placed on or in proximity to the hot plate, and switching the exhaust of the processing space from OFF to ON.
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Inventors:
TANAKA KOUICHIROU (JP)
OTSUKA YUKINOBU (JP)
TERASHITA YUICHI (JP)
OTSUKA YUKINOBU (JP)
TERASHITA YUICHI (JP)
Application Number:
PCT/JP2023/017040
Publication Date:
November 16, 2023
Filing Date:
May 01, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/316; H01L21/312; H05B3/00; H05B3/68
Foreign References:
| JP2021068886A | 2021-04-30 | |||
| JP2016115919A | 2016-06-23 | |||
| JP2018029133A | 2018-02-22 | |||
| JP2005085993A | 2005-03-31 | |||
| JP2000133647A | 2000-05-12 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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