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Patent Searching and Data


Title:
HEAT PUMP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/167136
Kind Code:
A1
Abstract:
This heat pump apparatus has a casing which houses thereinside: a compressor that compresses a refrigerant; a first heat exchanger that exchanges heat between the refrigerant compressed by the compressor and a liquid heat medium; a pressure reduction device that reduces the pressure of the refrigerant having passed through the first heat exchanger; a second heat exchanger that exchanges heat between air and the refrigerant, the pressure of which has been reduced by the pressure reduction device; and a blower that blows air to the second heat exchanger. The casing is partitioned into a blower chamber in which the blower is installed and a machine chamber in which the compressor is installed, by a partition plate which extends in the vertical direction. The second heat exchanger is installed, in the blower chamber, along the rear surface of the casing. The first heat exchanger is installed, in the machine chamber, below the compressor.

Inventors:
TONEGAWA TORU (JP)
YAMAUCHI TOSHIYA (JP)
Application Number:
PCT/JP2018/007312
Publication Date:
September 06, 2019
Filing Date:
February 27, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B30/02; F25B1/00; F25B31/00; F25B39/04; F28D7/02
Foreign References:
JP2012184892A2012-09-27
JP2005345006A2005-12-15
JPH03129833U1991-12-26
JP2008224072A2008-09-25
JP2005147619A2005-06-09
EP0069676A11983-01-12
FR2532729A11984-03-09
JPH0198842A1989-04-17
JP2000329380A2000-11-30
JP2017032184A2017-02-09
JP2012184892A2012-09-27
Other References:
See also references of EP 3760948A4
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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