Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/006389
Kind Code:
A1
Abstract:
This heat pump device 1 is provided with a compression mechanism which compresses a coolant, a motor which drives the compression mechanism, a shell 31 which houses the compression mechanism and the motor, a discharge muffler 2 which is disposed outside of the shell 31, a first tube which connects the compression mechanism to the discharge muffler 2, a first heat exchanger 4 which has a coolant inlet and which exchanges heat between the coolant and a heat medium, and a second tube which connects the discharge muffler 2 to the coolant inlet of the first heat exchanger 4. The shell 31 and the discharge muffler 2 are positioned adjacent to each other in space. The discharge muffler 2 and the first heat exchanger 4 are positioned adjacent to each other in space. The discharge muffler 2 is positioned at least partially in the space between the shell 31 and the first heat exchanger 4.
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Inventors:
TAKAYAMA KEISUKE (JP)
TACHIBANA HIROYUKI (JP)
KOIDE TORU (JP)
TACHIBANA HIROYUKI (JP)
KOIDE TORU (JP)
Application Number:
PCT/JP2015/069283
Publication Date:
January 12, 2017
Filing Date:
July 03, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B31/02; F04B39/00; F04C29/06; F25B1/00; F25B41/00
Domestic Patent References:
| WO2014083673A1 | 2014-06-05 |
Foreign References:
| JP2010223190A | 2010-10-07 | |||
| JP2003166472A | 2003-06-13 | |||
| JPH09196514A | 1997-07-31 | |||
| JP2009008363A | 2009-01-15 | |||
| JP2012107791A | 2012-06-07 | |||
| JP2005221088A | 2005-08-18 | |||
| JP2013096674A | 2013-05-20 | |||
| JPS629154A | 1987-01-17 | |||
| JPH0267823U | 1990-05-23 | |||
| JP2012145274A | 2012-08-02 | |||
| JP2008175066A | 2008-07-31 |
Other References:
See also references of EP 3318822A4
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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