Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190233
Kind Code:
A1
Abstract:
This heat pump device includes a low order-side circuit, a high order-side circuit, a water circuit, a use-side terminal, and a control device. The low order-side circuit circulates a first refrigerant. The high order-side circuit circulates a second refrigerant that exchanges heat with the first refrigerant in a refrigerant-to-refrigerant heat exchanger. The water circuit generates warm water through heat exchange with the second refrigerant in a water-refrigerant heat exchanger. The use-side terminal is connected to the water circuit and has a use-side heat exchanger and a flow rate regulation valve. When it is determined that a heat source-side heat exchanger is frosted, the control device controls a refrigerant circuit such that a first four-way valve is switched to start a first defrosting operation, and, if defrosting is not achieved, a second four-way valve is switched to start a second defrosting operation. When starting the first defrosting operation, the control unit controls a circulatory pump and the flow rate regulation valve in order to operate the circulatory pump in a state in which the flow rate regulation valve is open such that warm water flows into the use-side heat exchanger. Provided is a heat pump device that can ensure comfort of the user even during a defrosting operation.

Inventors:
KONDO MASAHIRO (JP)
SHIMANO DAIKI (JP)
SUDA KAZUKI (JP)
Application Number:
PCT/JP2023/011979
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU GENERAL LTD (JP)
International Classes:
F25B47/02; F25B1/00; F25B7/00; F25B30/02
Domestic Patent References:
WO2019193649A12019-10-10
WO2012043297A12012-04-05
WO2013151005A12013-10-10
Foreign References:
JP2011127878A2011-06-30
JP2014109405A2014-06-12
JP2012088005A2012-05-10
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: