HEAT PUMP SYSTEM - DAIKIN IND LTD

Title:

HEAT PUMP SYSTEM

Document Type and Number:

WIPO Patent Application WO/2010/098073

Kind Code:

A1

Abstract:

A heat pump system (1) is equipped with a heat-source-side coolant circuit (20) which has a heat-source-side compressor (21), a first use-side heat exchanger (41a) which functions as a radiator for heat-source-side coolant, and a heat-source-side heat exchanger (24) which acts as a radiator for heat-source-side coolant; and a use-side coolant circuit (40a) which has a use-side compressor (62a), a coolant-water heat exchanger (65a) which functions as a radiator for use-side coolant and heats an aqueous medium, and a first use-side heat exchanger (41a) which functions as an evaporator for the use-side coolant by means of heat radiation from the heat-source-side coolant. The heat pump system (1) regulates the capacity of the heat-source-side compressor (21) such that the saturation temperature corresponding to the pressure of the heat-source-side coolant during discharge from the heat-source-side compressor (21) meets a target temperature, and regulates the capacity of the use-side compressor (62a) such that the saturation temperature corresponding to the pressure of the use-side coolant during discharge from the use-side compressor (62a) meets a target temperature.

Inventors:

HONDA MASAHIRO (BE)

Application Number:

PCT/JP2010/001187

Publication Date:

September 02, 2010

Filing Date:

February 23, 2010

Export Citation:

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Assignee:

DAIKIN IND LTD (JP)
DAIKIN EUROPE NV (BE)
HONDA MASAHIRO (BE)

International Classes:

F25B7/00; F25B1/00; F25B13/00

Domestic Patent References:

WO2008117408A1

2008-10-02

Foreign References:

JP2005147544A	2005-06-09
JP2003042574A	2003-02-13
JPH11173711A	1999-07-02
JPH01144770U	1989-10-04
JPH0669664U	1994-09-30
JPS61101771A	1986-05-20
JPS60164157A	1985-08-27

Other References: