HEAT PUMP SYSTEM - DAIKIN IND LTD

Title:

HEAT PUMP SYSTEM

Document Type and Number:

WIPO Patent Application WO/2010/098074

Kind Code:

A1

Abstract:

A heat pump system (1) is equipped with a heat source side refrigerant circuit (20) including a heat source side compressor (21), a first utilization side heat exchanger (41a) which functions as a radiator for a heat source side refrigerant, and a heat source side heat exchanger (24) which functions as a radiator for the heat source side refrigerant; and a utilization side refrigerant circuit (40a) including a utilization side compressor (62a) which compresses utilization side refrigerant having a gauge pressure of 2.8 MPa or less corresponding to the saturation gas temperature of 65°C, a refrigerant-water heat exchanger (65a) which functions as a radiator for utilization side refrigerant and heats a water medium, and the first utilization side heat exchanger (41a) which functions as an evaporator for the utilization side refrigerant by radiating heat of the heat source side refrigerant. The weight of the utilization side refrigerant enclosed in the utilization side refrigerant circuit (40a) is 1-3 times of the weight of refrigerating machine oil which is enclosed for the purpose of lubricating the utilization side compressor (62a).

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Inventors:

HONDA MASAHIRO (BE)

Application Number:

PCT/JP2010/001188

Publication Date:

September 02, 2010

Filing Date:

February 23, 2010

Export Citation:

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Assignee:

DAIKIN IND LTD (JP)
DAIKIN EUROPE NV (BE)
HONDA MASAHIRO (BE)

International Classes:

F25B1/00; F25B7/00

Domestic Patent References:

WO2008117408A1

2008-10-02

Foreign References:

JPS6183833A	1986-04-28
JP2000002468A	2000-01-07
JPS60164157A	1985-08-27

Other References: