Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/111621
Kind Code:
A1
Abstract:
This heat pump system has: a heat pump cycle (10); recovery parts (25, 35); and a high-temperature side heat reception part (20) and/or a low-temperature side heat reception part (30). The heat pump cycle has a compressor (11) that compresses and discharges a refrigerant, a radiator (12) that radiates heat of a high-pressure refrigerant compressed by the compressor, pressure reduction parts (15a, 15b) that reduce the pressure of the high-pressure refrigerant flowing out from the radiator, and heat sinks (16, 18) that evaporate a low-pressure refrigerant the pressure of which is reduced by the pressure reduction parts and sink heat. The recovery parts recover exhaust heat discharged from the compressor. The high-temperature side heat reception part causes the high-pressure refrigerant to radiate the heat recovered by the recovery parts. The low-temperature side heat reception part causes the low-pressure refrigerant to sink the heat recovered by the recovery parts.

Inventors:
KONAKADE YUKI (JP)
KATO YOSHIKI (JP)
FUSE TAKUYA (JP)
Application Number:
PCT/JP2018/041206
Publication Date:
June 13, 2019
Filing Date:
November 06, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP (JP)
International Classes:
F25B1/00; B60H1/22; B60H1/32; F25B5/02; F25B27/02
Foreign References:
JP2014148295A2014-08-21
JP2006321389A2006-11-30
JP2005308344A2005-11-04
CN206247684U2017-06-13
Attorney, Agent or Firm:
JIN Shunji (JP)
Download PDF:



 
Previous Patent: ELECTRIC COMPRESSOR

Next Patent: CONNECTION DEVICE